F4BM220 - A High-Performance Laminate for Demanding RF Applications

F4BM220 was developed through extensive material science research to push the boundaries of circuit board performance. Combining just the right ratios of PTFE, glass cloth and filler particles, it achieves best-in-class dielectric properties.

Clocking in at a tight Dk tolerance of 2.2 ±0.04, circuits exhibit repeatable resonance behavior essential for sensitive RF designs. Its loss tangent of only 0.001 further enables ultra-clean signal transmission up to 10GHz and beyond.

By balancing these constituents, F4BM220 also demonstrates class-leading dimensional stability. Its modest XY CTE of 25-34ppm and controlled 240ppm Z-axis coefficient ensure warpage stays below competitive laminates under extreme temperatures from -55°C to 155°C.

Our ISO-certified facility manufactures F4BM220 boards using IPC Class 2 processes like non-wettable HASL finishes. Standard sizes range from 65x101mm up to an expansive 392x256mm for more demanding applications.

Engineers designing sophisticated phased arrays, microwave feeds and basestation radios depend on F4BM220's ability to perform consistently in even the harshest exposure environments. Its resistance to thermal stress, irradiation and noxious gases emitted during production far surpass commodity laminates.

For your next high-frequency design project pushing limits, trust F4BM220 to keep up. Contact us to discuss your reliability requirements and how this meticulously formulated substrate can help optimize size, cost and performance.

F4BM220 - A High-Performance Laminate for Demanding RF Applications Images