RT/duroid 6010.2LM Copper Clad Laminate: High-Performance Material for Precision RF and Microwave Applications
In the world of high-frequency circuit design, where precision and reliability are paramount, RT/duroid 6010.2LM copper clad laminate stands out as a premium solution. Designed for microwave and RF applications, this laminate offers exceptional high dielectric constant (Dk = 10.2 ± 0.25), low-loss performance, and superior thermal stability, making it the go-to choice for professional designers and purchasing agents seeking to optimize their projects.
Why Choose RT/duroid 6010.2LM?
Engineered with ceramic-PTFE composites, RT/duroid 6010.2LM laminates are ideal for compact circuit designs operating at X-band frequencies or below. This material delivers repeatable electrical performance, low dissipation loss, and reliable plated-through holes (PTH), even in extreme environments. Whether you're designing radar systems, patch antennas, or satellite communication systems, RT/duroid 6010.2LM ensures unmatched performance and reliability.
Key Construction Details
| Parameter | Specification |
| Base Material | RT/duroid 6010.2LM |
| Layer Count | 2 Layers |
| Board Dimensions | 45.4mm x 31.8mm ± 0.15mm |
| Finished Thickness | 2.0mm |
| Copper Thickness | 1oz (35μm) on both layers |
| Dielectric Thickness | 1.905mm (75mil) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.30mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Solder Mask | None (Top and Bottom) |
| Silkscreen | Top: White, Bottom: None |
| Electrical Testing | 100% tested prior to shipment |
Features of RT/duroid 6010.2LM
RT/duroid 6010.2LM laminates are packed with features that make them the preferred choice for high-frequency circuit designers:
High Dielectric Constant (Dk): 10.2 ± 0.25 at 10GHz, enabling circuit size reduction and high component density.
Low Dissipation Factor (Df): 0.0023 at 10GHz, delivering low-loss performance for efficient signal transmission.
Thermal Stability: High Decomposition Temperature (Td) of 500°C, ensuring reliability in high-power and high-temperature applications.
Moisture Absorption: 0.01%, ensuring consistent performance even in humid environments.
Low Z-Axis Expansion: 47 ppm/°C, providing reliable plated-through holes (PTH) in multi-layer boards.
Thermal Conductivity: 0.86 W/mK, ensuring effective heat dissipation in high-power designs.
Flammability Rating: UL 94-V0, ensuring safety and compliance with industry standards.
Conclusion
The RT/duroid 6010.2LM copper clad laminate is a high-performance, low-loss material designed for advanced RF and microwave applications. Its high dielectric constant, low dissipation factor, and thermal stability make it the ideal solution for professional designers aiming to create reliable, compact, and efficient high-frequency circuits.
Whether you're designing patch antennas, radar systems, or satellite communications, RT/duroid 6010.2LM provides the precision and reliability you need to succeed in today's competitive market. Contact us today to learn more about how RT/duroid 6010.2LM can elevate your next project!
|
|
RT/duroid 6010.2LM Copper Clad Laminate: High-Performance Material for Precision RF and Microwave Applications Images
|
